 | Materials for Electronic Packaging |  |
| | Publisher: Butterworth-Heinemann | Publication: 1995, English | ISBN: 9780750693141 | Pages: 368 |
Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors.
Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science.
Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems.
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.
About the Author
Deborah Chung is Niagara Mohawk endowed Chief Professor, Professor of Mechanical and Aerospace Engineering, at the State University of New York. | |
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